APPLICATION

The growth in Electrical/ Hybrid Electrical Vehicles and advancement with ICE have pushed the automotive segment to next level for semiconductor packaging – aiming to deliver greater safety technology and green technologies. Vietsemitech understands the fast evolving needs of the auto industry and has been adapting to these changes with latest developments in the semiconductor technology. Vietsemitech has a strong position and packaging experience in segments related but not limited to growing vehicle electrification, under the hood applications, and the vehicle safety and comfort segment. 

5G technology is here albeit with many challenges. Sub6G/mmWave will be used at a commercial scale for the first time, and gain momentum in times to come. 5G means faster speed, low latency, high throughput, more bandwidth, and a wider range than previous networks. 5G deployment will accelerate the realization of innovative products such as AI, AR/VR, autonomous cars, IoT, and many more. 

The rise in data volume is parallel with the implementation of the automation of smart machines as well as the need for computational  power and connectivity. The Cloud is seen as the solution for these data processing.

Vietsemitech provides solution for power management packaging for the Cloud network infrastructure. These power management packaging includes the hardware components for the power supply, microcontroller and the server rack such as the SiP in QFN/DFN, TO, SOT, and SoC. Vietsemitech is striving further to improve the process and packaging capability in power packaging.