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Our services
Our services
Vietsemitech with extensive experience and capability is ready to provide a full range of test services, covering both the “front-end” process through wafer probing, as well as the “back-end” process, which includes final testing on assembled device.
As a Test solution partner, we offered services which includes:
Test consultation & development services for both new products and platform migration
Wafer Probing services
Final testing from simplest open/short test on singulated units to advanced package testing with fully automated machine, high parallelism testing, strip testing, burn in, reliability testing & etc.
A full suite of optimized post-test services including tape-and-reel, baking, pack & labelling, drop-ship service with short cycle time & rapid delivery of the final products to the end customer
Assembly
Assembly
IC Packaging
Wafer Level Packaging
Flip Chips
Wire Bond BGA
Leadframe
System in Package
Final Test
Final Test
Chip Probing
Chip Probing
Final test
Research and Development
Research and Development
Our team is composed of people from various backgrounds and strong industry expertise. We have expertise in material development that includes mechanical, thermal and electrical testing lab, along with simulation & design team – one of the core strengths in package development. In order to ensure the success of high volume manufacturing, we have the package development team as well as the process & automation development team that function together coherently.
These people are the ones running various experimental designs in our dedicated R&D line, aiming to perfect the processes & product outcomes. Furthermore, our team has full capability to run reliability testing to ensure the robustness of the products that are assembled and manufactured. Last but not the least, we have the intellectual property team to compile our innovative technology and to ensure that the technology we venture in is novel and protected.
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